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Free tools for parsing TLV, decoding TVR and TSI, running 3DES and AES, and understanding what happened in an EMV transaction. Everything runs in your browser, so your data never leaves your machine.

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EMV Level 2 Abstraction

How to put an abstraction layer between your payment application and EMV Level 2 kernels, so one integration can drive contact and contactless kernels across different EMV terminals.

Level 2 · Kernels · Architecture

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Event

EMVCo Technical Meeting held in Vancouver

EMVCo held its November 2026 Technical Meeting in Vancouver, Canada, bringing together Associates working on the EMV specifications. Outcomes typically show up in bulletins over the following months.

Source: EMVCo newsletter Q2 2026 ↗
EMVCo bulletin

Contact chip features sunsetting: phase 1 bulletins updated

EMVCo released version 3.0 of General Bulletin 60 and version 2.0 of Specification Bulletin 308, which cover the first phase of retiring older EMV contact chip features. Terminal and kernel teams should check which features are affected before planning their next contact kernel release.

Source: EMVCo specifications library ↗
EMVCo bulletin

Contactless Books A and B updated

Specification Bulletins 326 and 327 update EMV Contactless Book A (architecture and general requirements) and Book B (Entry Point). Both are public. Any change to Entry Point behaviour can affect kernel selection on every contactless reader.

Source: EMVCo specifications library ↗

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